поискавой системы для электроныых деталей |
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BAT30F3 датащи(PDF) 6 Page - STMicroelectronics |
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BAT30F3 датащи(HTML) 6 Page - STMicroelectronics |
6 / 10 page PCB recommendations BAT30F3 6/10 Doc ID 16915 Rev 2 Figure 9. Flip Chip tape and reel specification (dimensions in mm) 4 PCB recommendations 4.1 Design For optimum electrical performance and highly reliable solder joints, STMicroelectronics recommends the PCB design recommendations listed in Table 3. Note: A gold layer finishing on the PCB pad that is too thick (0.2 µm maximum) is not recommended (low joint reliability). User direction of unreeling All dimensions in mm 4.0 ± 0.1 2.0 ± 0.05 2.0 ± 0.1 Ø 1.55 ± 0.05 0.43 ± 0.1 0.57 ± 0.05 0.20 ± 0.05 Table 3. PCB design recommendations for solder bar pitch 400 µm For NSMD PCB non solder mask defined Oblong pad: 370 x 180 µm – Micro via SSBU allowed – Micro via SBU to be avoided – Micro via SBU filled (under qualification) Track: – Only one track per pad – Maximum track width = 100 µm Track layout must be symmetrical to the die axis (to homogenize stress and welding attraction during reflow assembly) For SMD PCB solder mask defined Oblong pad: – Micro via SSBU allowed – Micro via SBU to be avoided – Micro via SBU filled (under qualification) PCB Pad Finishing Cu – Ni (2-6 µm) - Au (0.2 µm max) |
Аналогичный номер детали - BAT30F3 |
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Аналогичное описание - BAT30F3 |
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