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FAN2108 датащи(PDF) 4 Page - Fairchild Semiconductor

номер детали FAN2108
подробное описание детали  TinyBuck??3-24 V Input, 8 A, High-Efficiency, Integrated Synchronous Buck Regulator
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производитель  FAIRCHILD [Fairchild Semiconductor]
домашняя страница  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN2108 датащи(HTML) 4 Page - Fairchild Semiconductor

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© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2108 • Rev. 1.0.2
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
Conditions
Min.
Max.
Unit
VIN to PGND
28
V
VCC to AGND
AGND=PGND
6
V
BOOT to PGND
35
V
BOOT to SW
-0.3
6.0
V
SW to PGND
Continuous
-0.5
24.0
V
Transient (t < 20 ns, f < 600 KHz)
-5
30
V
All other pins
-0.3
VCC+0.3
V
ESD
Human Body Model, JEDEC JESD22-A114
2
kV
Charged Device Model, JEDEC JESD22-C101
2.5
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
VCC
Bias Voltage
VCC to AGND
4.5
5.0
5.5
V
VIN
Supply Voltage
VIN to PGND
3
24
V
TA
Ambient Temperature
FAN2108MPX
-10
+85
°C
FAN2108EMPX
-40
+85
°C
TJ
Junction Temperature
+125
°C
f
Switching Frequency
600
kHz
Thermal Information
Symbol
Parameter
Min.
Typ.
Max.
Unit
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+300
°C
TVP
Vapor Phase, 60 Seconds
+215
°C
TI
Infrared, 15 Seconds
+220
°C
θJC
Thermal Resistance: Junction-to-Case
P1 (Q2)
4
°C/W
P2 (Q1)
7
°C/W
P3
4
°C/W
θJ-PCB
Thermal Resistance: Junction-to-Mounting Surface
(1)
35
°C/W
PD
Power Dissipation, TA=25°C
(1)
2.8
W
Note:
1.
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results
are dependent on mounting method and surface related to the design.


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