производитель | номер детали | датащи | подробное описание детали |
Sumida Corporation |
CDMC80D50AA
|
221Kb / 4P |
Metal compound molding type construction
|
Ohmite Mfg. Co. |
RES-WH-WN
|
305Kb / 2P |
Encapsulated by epoxy molding compound
|
Fairchild Semiconductor |
FMG1G50US60H
|
627Kb / 9P |
Molding Type Module
|
FM2G200US60
|
701Kb / 9P |
Molding Type Module
|
FMG2G300US60E
|
721Kb / 7P |
Molding Type Module
|
FM2G75US60
|
711Kb / 9P |
Molding Type Module
|
FM2G50US60
|
703Kb / 9P |
Molding Type Module
|
FMG2G300US60
|
553Kb / 7P |
Molding Type Module
|
FMG2G400LS60
|
384Kb / 6P |
Molding Type Module
|
FMG2G75US120
|
500Kb / 7P |
Molding Type Module
|