AD8055/AD8056

–3–

REV. B

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V

Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . 1.3 W

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.8 W

SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . 0.5 W

microSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . 0.6 W

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . .

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .

±2.5 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range N, R . . . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . .

–40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . +300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead Plastic DIP Package:

8-Lead SOIC Package:

5-Lead SOT-23-5 Package:

8-Lead microSOIC Package:

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8055/

AD8056 is limited by the associated rise in junction temperature.

The maximum safe junction temperature for plastic encapsu-

lated devices is determined by the glass transition temperature

of the plastic, approximately +150

°C. Exceeding this limit tem-

porarily may cause a shift in parametric performance due to a

change in the stresses exerted on the die by the package. Exceeding

a junction temperature of +175

°C for an extended period can

result in device failure.

While the AD8055/AD8056 are internally short circuit protected,

this may not be sufficient to guarantee that the maximum junc-

tion temperature (+150

°C) is not exceeded under all conditions.

To ensure proper operation, it is necessary to observe the maxi-

mum power derating curves.

AMBIENT TEMPERATURE – C

–50

0

2.0

1.5

1.0

0.5

8-LEAD SOIC

PACKAGE

–40 –30 –20 –10

0

102030

4050

6070

8090

8-LEAD PLASTIC DIP PACKAGE

SOIC

SOT-23-5

Figure 2. Plot of Maximum Power Dissipation vs.

Temperature for AD8055/AD8056

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8055/AD8056 features proprietary ESD protection circuitry, permanent dam-

age may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Brand Code

AD8055AN

–40

°C to +85°C

Plastic DIP

N-8

AD8055AR

–40

°C to +85°C

Small Outline Package (SOIC)

SO-8

AD8055AR-REEL

–40

°C to +85°C

13" Tape and Reel

SO-8

AD8055AR-REEL7

–40

°C to +85°C

7" Tape and Reel

SO-8

AD8055ART-REEL

–40

°C to +85°C

13" Tape and Reel

RT-5

H3A

AD8055ART-REEL7

–40

°C to +85°C

7" Tape and Reel

RT-5

H3A

AD8056AN

–40

°C to +85°C

Plastic DIP

N-8

AD8056AR

–40

°C to +85°C

Small Outline Package (SOIC)

SO-8

AD8056AR-REEL

–40

°C to +85°C

13" Tape and Reel

SO-8

AD8056AR-REEL7

–40

°C to +85°C

7" Tape and Reel

SO-8

AD8056ARM

–40

°C to +85°C

microSOIC

RM-8

H5A

AD8056ARM-REEL

–40

°C to +85°C

13" Tape and Reel

RM-8

H5A

AD8056ARM-REEL7

–40

°C to +85°C

7" Tape and Reel

RM-8

H5A