поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

FDS2572 датащи(PDF) 7 Page - Fairchild Semiconductor

номер детали FDS2572
подробное описание детали  150V, 0.047 Ohms, 4.9A, N-Channel UltraFET Trench MOSFET
Download  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  FAIRCHILD [Fairchild Semiconductor]
домашняя страница  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDS2572 датащи(HTML) 7 Page - Fairchild Semiconductor

Back Button FDS2572 Datasheet HTML 3Page - Fairchild Semiconductor FDS2572 Datasheet HTML 4Page - Fairchild Semiconductor FDS2572 Datasheet HTML 5Page - Fairchild Semiconductor FDS2572 Datasheet HTML 6Page - Fairchild Semiconductor FDS2572 Datasheet HTML 7Page - Fairchild Semiconductor FDS2572 Datasheet HTML 8Page - Fairchild Semiconductor FDS2572 Datasheet HTML 9Page - Fairchild Semiconductor FDS2572 Datasheet HTML 10Page - Fairchild Semiconductor FDS2572 Datasheet HTML 11Page - Fairchild Semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 7 / 12 page
background image
©2001 Fairchild Semiconductor Corporation
FDS2572 Rev. B, October 2001
Thermal Resistance vs. Mounting Pad Area
The maximum rated junction temperature, TJM, and the
thermal
resistance
of
the
heat
dissipating
path
determines the maximum allowable device power
dissipation, PDM, in an application.
Therefore the
application’s ambient temperature, TA (
oC), and thermal
resistance RθJA (
oC/W) must be reviewed to ensure that
TJM is never exceeded.
Equation 1 mathematically
represents the relationship and serves as the basis for
establishing the rating of the part.
In using surface mount devices such as the SO8
package, the environment in which it is applied will have
a significant influence on the part’s current and maximum
power dissipation ratings. Precise determination of PDM
is complex and influenced by many factors:
1. Mounting pad area onto which the device is attached
and whether there is copper on one side or both sides
of the board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the
part, the board and the environment they are in.
Fairchild provides thermal information to assist the
designer’s preliminary application evaluation. Figure 19
defines the RθJA for the device as a function of the top
copper (component side) area. This is for a horizontally
positioned FR-4 board with 1oz copper after 1000
seconds of steady state power with no air flow. This
graph provides the necessary information for calculation
of the steady state junction temperature or power
dissipation. Pulse applications can be evaluated using
the Fairchild device Spice thermal model or manually
utilizing the normalized maximum transient thermal
impedance curve.
Thermal resistances corresponding to other copper
areas can be obtained from Figure 19 or by calculation
using Equation 2. The area, in square inches is the top
copper area including the gate and source pads.
The transient thermal impedance (ZθJA) is also effected
by varied top copper board area. Figure 20 shows the
effect of copper pad area on single pulse transient
thermal impedance. Each trace represents a copper pad
area in square inches corresponding to the descending
list in the graph. Spice and SABER thermal models are
provided for each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms.
For pulse widths less than 100ms the transient thermal
impedance is determined by the die and package.
Therefore,
CTHERM1
through
CTHERM5
and
RTHERM1 through RTHERM5 remain constant for each
of the thermal models. A listing of the model component
values is available in Table 1.
(EQ. 1)
P
DM
T
JM
T
A
()
RθJA
-----------------------------
=
(EQ. 2)
RθJA
64
26
0.23
Area
+
-----------------------------
+
=
Figure 19. Thermal Resistance vs Mounting
Pad Area
100
150
200
0.001
0.01
0.1
1
10
50
RθJA = 64 + 26/(0.23+Area)
AREA, TOP COPPER AREA (in2)
Figure 20. Thermal Impedance vs Mounting Pad Area
30
60
90
120
150
0
10-1
100
101
102
103
t, RECTANGULAR PULSE DURATION (s)
COPPER BOARD AREA - DESCENDING ORDER
0.04 in2
0.28 in2
0.52 in2
0.76 in2
1.00 in2


Аналогичный номер детали - FDS2572

производительномер деталидатащиподробное описание детали
logo
Fairchild Semiconductor
FDS2570 FAIRCHILD-FDS2570 Datasheet
232Kb / 8P
   150V N-Channel PowerTrench MOSFET
FDS2570 FAIRCHILD-FDS2570 Datasheet
106Kb / 6P
   150V N-Channel PowerTrench MOSFET
FDS2570 FAIRCHILD-FDS2570 Datasheet
85Kb / 12P
   Power Converter Topology and MOSFET Selection for 48-V Telecom
FDS2570 FAIRCHILD-FDS2570_01 Datasheet
106Kb / 6P
   150V N-Channel PowerTrench MOSFET
More results

Аналогичное описание - FDS2572

производительномер деталидатащиподробное описание детали
logo
Fairchild Semiconductor
FDMC2674 FAIRCHILD-FDMC2674 Datasheet
334Kb / 6P
   N-Channel UltraFET Trench MOSFET
logo
Guangdong Kexin Industr...
KDS2572 KEXIN-KDS2572 Datasheet
55Kb / 2P
   N-Channel UltraFET Trench MOSFET
logo
Fairchild Semiconductor
FDMS2572 FAIRCHILD-FDMS2572 Datasheet
156Kb / 6P
   N-Channel UltraFET Trench MOSFET
FDS2672_F085 FAIRCHILD-FDS2672_F085 Datasheet
563Kb / 6P
   N-Channel UltraFET Trench MOSFET
FDMS2572 FAIRCHILD-FDMS2572_07 Datasheet
513Kb / 7P
   N-Channel UltraFET Trench짰 MOSFET 150V, 27A, 47m?
HUF75842P3 FAIRCHILD-HUF75842P3 Datasheet
197Kb / 10P
   43A, 150V, 0.042 Ohm, N-Channel, UltraFET Power MOSFET
HUFA75842P3 FAIRCHILD-HUFA75842P3 Datasheet
198Kb / 10P
   43A, 150V, 0.042 Ohm, N-Channel, UltraFET Power MOSFET
logo
Intersil Corporation
HUF75823D3 INTERSIL-HUF75823D3 Datasheet
186Kb / 11P
   14A, 150V, 0.150 Ohm, N-Channel, UltraFET Power MOSFET
logo
Fairchild Semiconductor
HUF75823D3 FAIRCHILD-HUF75823D3 Datasheet
211Kb / 10P
   14A, 150V, 0.150 Ohm, N-Channel, UltraFET Power MOSFET
HUF75831SK8 FAIRCHILD-HUF75831SK8 Datasheet
250Kb / 11P
   3A, 150V, 0.095 Ohm, N-Channel, UltraFET Power MOSFET
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12


датащи скачать

Go To PDF Page


ссылки URL




Конфиденциальность
ALLDATASHEETRU.COM
Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com