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TC1016-2.8VCTTR датащи(PDF) 11 Page - Microchip Technology |
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TC1016-2.8VCTTR датащи(HTML) 11 Page - Microchip Technology |
11 / 22 page © 2005 Microchip Technology Inc. DS21666B-page 11 TC1016 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal-protection circuitry shuts the regulator off when die temperature exceeds approximately 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 5.2 Power Dissipation The TC1016 is available in the SC-70 package. The thermal resistance for the SC-70 package is approxi- mately 450°C/W when the copper area used in the PCB layout is similar to the JEDEC J51-7 high thermal conductivity or Semi G42-88 standards. For applica- tions with larger or thicker copper areas, the thermal resistance can be lowered. See AN792 “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application” (DS00792), for a method to determine the thermal resistance for a particular application. The TC1016 power dissipation capability is dependant upon several variables: input voltage, output voltage, load current, ambient temperature and maximum junction temperature. The absolute maximum steady- state junction temperature is rated at 125°C. The power dissipation within the device is equal to: EQUATION 5-1: The V IN x IGND term is typically very small when com- pared to the (V IN-VOUT) x ILOAD term simplifying the power dissipation within the LDO to be: EQUATION 5-2: To determine the maximum power dissipation capability, the following equation is used: EQUATION 5-3: Given the following example: Find: 1. Internal power dissipation: 2. Junction temperature: 3. Maximum allowable dissipation: In this example, the TC1016 dissipates approximately 82.2 mW and the junction temperature is raised 37°C over the 55°C ambient to 92°C. The absolute maximum power dissipation is 155 mW when given a maximum ambient temperature of 55°C. Input voltage, output voltage or load current limits can also be determined by substituting known values in Equation 5-2 and Equation 5-3. 5.3 Layout Considerations The primary path for heat conduction out of the SC-70 package is through the package leads. Using heavy, wide traces at the pads of the device will facilitate the removal of heat within the package, thus lowering the thermal resistance R θJA. By lowering the thermal resistance, the maximum internal power dissipation capability of the package is increased. FIGURE 5-1: Suggested layout P D V IN V OUT – () I LOAD V IN I GND × + × = P D V IN V OUT – () I LOAD × = P DMAX T J_MAX T A_MAX – () R θ JA ------------------------------------------------- = Where: TJ_MAX = maximum junction temperature allowed TA_MAX = the maximum ambient temperature allowed R θJA = the thermal resistance from junction-to-air VIN = 3.0V to 4.1V VOUT = 2.8V ±2.5% ILOAD = 60 mA (output current) TAMAX = 55°C (max. ambient temp.) P DMAX V IN_MAX V OUT_MIN – () I LOA D × = 4.1V 2.8 0.975 () × – () 60mA × = 82.2mW = T J_MAX P DMAX R θ JA × = 82.2mWatts 450 °C/W T AMAX + × = 92 °C = 37 °C 55°C + = P D T J_MAX T A_MAX – R θ JA -------------------------------------------- = 155mW = 125 °C 55°C – 450 °C/W ----------------------------------- = SHDN U1 V IN V OUT GND C1 C2 |
Аналогичный номер детали - TC1016-2.8VCTTR |
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Аналогичное описание - TC1016-2.8VCTTR |
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