V

CC

PWM1

+I

s1

-I

s2

+NTC

-NTC

+I

s2

-I

s2

PWM2

V

OUT

SS

RT

V

CC

V

OUT

V

OUT

V

IN

Multi-Phase

Controller

CSD95372A

CSD95372A

P

GND

0

10

20

30

40

50

60

20

30

40

50

60

70

80

90

100

0

2

4

6

8

10

12

14

16

Output Current (A)

G001

CSD95372AQ5M

www.ti.com

SLPS416 – JUNE 2013

Synchronous Buck NexFET™ Power Stage

1

FEATURES

APPLICATIONS

23

•

60A Continuous Operating Current Capability

•

Multiphase Synchronous Buck Converter

•

92.4% System Efficiency at 30A

–

High Frequency Applications

•

Ultra Low Power Loss of 3.3W at 30A

–

High Current, Low Duty Cycle Applications

•

High Frequency Operation (up to 2 MHz)

•

Point-of-Load DC-DC Converters

•

High Density - SON 5x6-mm Footprint

•

Memory and Graphic Cards

•

Ultra Low Inductance Package

•

Desktop and Server VR11.x and VR12.x for

VCore Synchronous Buck Converters

•

System Optimized PCB Footprint

•

3.3V and 5V PWM Signal Compatible

ORDERING INFORMATION

•

Diode Emulation Mode with FCCM

Device

Package

Media

Qty

Ship

•

Analog Temperature Output

SON 5 × 6-mm

13-Inch

Tape and

CSD95372AQ5M

2500

Plastic Package

Reel

Reel

•

Input Voltages up to 16V

•

Three-State PWM Input

•

Integrated Bootstrap Switch

•

Optimized Dead Time for Shoot Through

Protection

•

RoHS Compliant – Lead Free Terminal Plating

•

Halogen Free

DESCRIPTION

The CSD95372AQ5M NexFET™ Power Stage is a highly optimized design for use in a high power, high density

Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the

power stage switching function. The driver IC has a built-in selectable diode emulation function that enables

DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high

speed switching capability in a small 5x6mm outline package. It also integrates the temperature sensing

functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized

to help reduce design time and simplify the completion of the overall system design.

Figure 1. Application Diagram

Figure 2. Efficiency and Power Loss

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NexFET is a trademark of Texas Instruments.

3

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.