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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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HLMP-Y402-G0000 датащи(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-Y402-G0000 датащи(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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6 / 7 page  6 Precautions: Assembly method: • This product is not meant for auto-insertion. Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room tempera- ture. The solder joint formed will absorb the mechani- cal stress of the lead cutting from traveling to the LED chip die attach and wirebond. • During lead forming, the leads should be bent at a point at least 3mm from the base of the lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering at normal temperature. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105° C Max. – Preheat Time 60 sec Max – Peak Temperature 250° C Max. 260° C Max. Dwell Time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to pe- riodically check on the soldering profile to ensure the soldering profile used is always conforming to recom- mended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. • Therefore, the soldered PCB must be allowed to cool to room temperature, 25° C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through-hole sizes for LED component leads: Led Component Lead Size Diagonal Plated Through Hole Diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED component. |
Аналогичный номер детали - HLMP-Y402-G0000 |
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Аналогичное описание - HLMP-Y402-G0000 |
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