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HLMP-CB36-RSBDD датащи(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CB36-RSBDD датащи(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 11 page 9 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress in- duced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm.Soldering the LED closer than 1.59 mm might damage the LED. • Recommended soldering conditions: ManualSolder WaveSoldering Dipping Pre-heatTemperature 105°CMax. – Pre-heatTime 0secMax. – PeakTemperature 50°CMax. 60°CMax. DwellTime secMax. 5secMax. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LEDComponent PlatedThrough LeadSize Diagonal HoleDiameter 0.457x0.457mm 0.646mm 0.976to1.078mm (0.018x0.018inch) (0.05inch) (0.08to0.04inch) 0.508x0.508mm 0.718mm 1.049to1.150mm (0.00x0.00inch) (0.08inch) (0.041to0.045inch) Note: Refer to application note AN1027 for more information on soldering LED components. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to daily check on the soldering profile to ensure the soldering profile is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if samewave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single wire bond, as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Note:Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. Avago Technologies LED Configuration InGaN Device • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion.Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. 1.59mm ANODE |
Аналогичный номер детали - HLMP-CB36-RSBDD |
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Аналогичное описание - HLMP-CB36-RSBDD |
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