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HLMP-CE24-VXQDD датащи(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CE24-VXQDD датащи(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 11 page 9 Avago Technologies LED configuration Precautions: Lead Forming: • The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering condition: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 50 °C Max. 60 °C Max. Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. • Recommended PC board plated through holes size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.05 inch) 0.976 to 1.078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.718 mm (0.08 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to application note AN1027 for more information on soldering LED components. Cathode 1.59mm |
Аналогичный номер детали - HLMP-CE24-VXQDD |
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Аналогичное описание - HLMP-CE24-VXQDD |
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