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2PB709BSL датащи(PDF) 3 Page - NXP Semiconductors

номер детали 2PB709BSL
подробное описание детали  50 V, 200 mA PNP general-purpose transistors
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

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2PB709BRL_2PB709BSL
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 28 June 2010
3 of 13
NXP Semiconductors
2PB709BRL; 2PB709BSL
50 V, 200 mA PNP general-purpose transistors
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -250
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
FR4 PCB, standard footprint
Fig 1.
Power derating curve
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb (°C)
−75
175
125
25
75
−25
006aaa990
100
200
300
Ptot
(mW)
0
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air
[1] -
-
500
K/W
Rth(j-sp)
thermal resistance from junction
to solder point
-
-
140
K/W


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