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BC847CT датащи(PDF) 5 Page - NXP Semiconductors |
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BC847CT датащи(HTML) 5 Page - NXP Semiconductors |
5 / 15 page BC847_BC547_SER_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 07 — 10 December 2008 5 of 15 NXP Semiconductors BC847/BC547 series 45 V, 100 mA NPN general-purpose transistors 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 45 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp ≤ 1ms - 200 mA IBM peak base current single pulse; tp ≤ 1ms - 100 mA Ptot total power dissipation Tamb ≤ 25 °C SOT23 [1] - 250 mW SOT323 [1] - 200 mW SOT416 [1] - 150 mW SOT883 [2][3] - 250 mW SOT54 [1] - 500 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air SOT23 [1] - - 500 K/W SOT323 [1] - - 625 K/W SOT416 [1] - - 833 K/W SOT883 [2][3] - - 500 K/W SOT54 [1] - - 250 K/W |
Аналогичный номер детали - BC847CT |
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Аналогичное описание - BC847CT |
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