поискавой системы для электроныых деталей |
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TLC27M4AIDG4 датащи(PDF) 4 Page - Texas Instruments |
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TLC27M4AIDG4 датащи(HTML) 4 Page - Texas Instruments |
4 / 50 page BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 ´ 4 MINIMUM TJmax = 150°C TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN– VDD (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN– 2OUT (11) GND + – 3OUT 3IN + 3IN– (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN– 68 108 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (13) (14) TLC27M4, TLC27M4A, TLC27M4B, TLC27M4Y, TLC27M9 SLOS093D – OCTOBER 1987 – REVISED OCTOBER 2012 www.ti.com TLC27M4Y chip information This chip, when properly assembled, displays characteristics similar to the TLC27M4C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. 4 Submit Documentation Feedback Copyright © 1987–2012, Texas Instruments Incorporated Product Folder Links: TLC27M4 TLC27M4A TLC27M4B TLC27M4Y TLC27M9 |
Аналогичный номер детали - TLC27M4AIDG4 |
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Аналогичное описание - TLC27M4AIDG4 |
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