CSPPT32-560F datasheet(1/4 Pages) CALMIRCO

номер детали	CSPPT32-560F

подробное описание детали	CHIP SCALE PARALLEL TERMINATION ARRAY

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производитель	CALMIRCO [California Micro Devices Corp]

домашняя страница	http://www.calmicro.com

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11/10/2000

1

CSPPT

CALIFORNIA MICRO DEVICES

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

Chip Scale Parallel Termination Array

Features

• 8,16 or 32 integrated high frequency

bussed terminations

• Ultra small footprint Chip Scale Package

• Ceramic substrate

• 0.35mm Eutectic Solder Bumps, 0.65mm pitch

Product Description

The CSPPT is a high performance Integrated Passive

Device (IPD) which provides parallel terminations

suitable for use in high speed bus applications. Eight (8),

sixteen (16), or thirty-two (32) parallel termination

versions are provided. These resistors provide excellent

high frequency performance in excess of 3GHz and are

manufactured to an absolute tolerance as low as ±1%.

Applications

• Parallel resistive bus termination

• Bussed resistor array

C1290700

SCHEMATIC DIAGRAMS

The Chip Scale Package provides an ultra small

footprint for this IPD and provides minimal parasitics

compared to conventional packaging. Typical bump

inductance is less than 25pH. The large solder bumps

and ceramic substrate allow for standard attachment to

laminate printed circuit boards without the use of

underfill.

CSPPT08

CSPPT16

CSPPT32

R1

B

A

12

4

R1

3

R1

5

R1

B

A

12

4

R1

3

R1

5

R1

D

C

R1

B

A

12

4

R1

3

R1

5

R1

D

C

R1

67

9

R1

8

R1

10

R1

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CSPPT32-560F датащи(PDF) 1 Page - California Micro Devices Corp

CSPPT32-560F датащи(HTML) 1 Page - California Micro Devices Corp

Аналогичный номер детали - CSPPT32-560F

Аналогичное описание - CSPPT32-560F

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