CYStech Electronics Corp.

Spec. No. : C817FP

Issued Date : 2011.01.13

Revised Date : 2011.09.14

Page No. : 6/6

BTB1424FP

CYStek Product Specification

TO-220FP Dimension

*: Typical

Inches

Marking:

B1424

□□

1 2 3

Style: Pin 1.Base 2.Collector 3.Emitter

3-Lead TO-220FP Plastic Package

CYStek Package Code: FP

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.169

0.185

4.300

4.700

D

0.392

0.408

9.960

10.360

A1

0.051 REF

1.300 REF

E

0.583

0.598

14.800

15.200

A2

0.110

0.126

2.800

3.200

e

0.100 TYP

2.540 TYP

A3

0.098

0.114

2.500

2.900

F

0.106 REF

2.700 REF

b

0.020

0.030

0.500

0.750

Φ

0.138 REF

3.500 REF

b1

0.043

0.053

1.100

1.350

L

1.102

1.118

28.000

28.400

b2

0.059

0.069

1.500

1.750

L1

0.067

0.075

1.700

1.900

c

0.020

0.030

0.500

0.750

L2

0.075

0.083

1.900

2.100

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.