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LM2587 датащи(PDF) 8 Page - Texas Instruments |
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LM2587 датащи(HTML) 8 Page - Texas Instruments |
8 / 32 page LM2587 SNVS115D – APRIL 2000 – REVISED APRIL 2013 www.ti.com All Output Voltage Versions Electrical Characteristics (1) (continued) Specifications with standard type face are for TJ = 25°C, and those in bold type face apply over full Operating Temperature Range. Unless otherwise specified, VIN = 5V. Symbol Parameters Conditions Typical Min Max Units ISS Soft Start Current VFEEDBACK = 0.92V 11.0 8.0/7.0 17.0/19.0 μA VCOMP = 1.0V D Maximum Duty Cycle RLOAD = 100Ω 98 93/90 % See(3) IL Switch Leakage Switch Off 15 300/600 μA Current VSWITCH = 60V VSUS Switch Sustaining dV/dT = 1.5V/ns 65 V Voltage VSAT Switch Saturation ISWITCH = 5.0A 0.7 1.1/1.4 V Voltage ICL NPN Switch 6.5 5.0 9.5 A Current Limit COMMON DEVICE PARAMETERS(5) θJA Thermal Resistance NDH Package, Junction to Ambient(6) 65 θJA NDH Package, Junction to Ambient(7) 45 θJC NDH Package, Junction to Case 2 θJA °C/W KTT Package, Junction to Ambient(8) 56 θJA KTT Package, Junction to Ambient(9) 35 θJA KTT Package, Junction to Ambient(10) 26 θJC KTT Package, Junction to Case 2 (5) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the LM2587 is used as shown in Figure 7 and Figure 8, system performance will be as specified by the system parameters. (6) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area. (7) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads. (8) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper. (9) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. (10) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple® software. 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2587 |
Аналогичный номер детали - LM2587 |
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Аналогичное описание - LM2587 |
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