поискавой системы для электроныых деталей |
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DAC3482 датащи(PDF) 10 Page - Texas Instruments |
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DAC3482 датащи(HTML) 10 Page - Texas Instruments |
10 / 92 page DAC3482 SLAS748E – MARCH 2011 – REVISED JULY 2013 www.ti.com THERMAL INFORMATION DAC3482 THERMAL METRIC(1) RKD PACKAGE ZAY PACKAGE UNITS (88) PINS (196) BALL θJA Junction-to-ambient thermal resistance(2) 22.1 37.6 θJCtop Junction-to-case (top) thermal resistance(3) 7.1 6.8 θJCbot Junction-to-case (bottom) thermal resistance(4) 0.6 N/A °C/W θJB Junction-to-board thermal resistance(5) 4.7 16.8 ψJT Junction-to-top characterization parameter(6) 0.1 0.2 ψJB Junction-to-board characterization parameter(7) 4.6 16.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer (5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (6) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). spacer RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Recommended operating junction temperature 105 TJ °C Maximum rated operating junction temperature(1) 125 TA Recommended free-air temperature –40 25 85 °C (1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: DAC3482 |
Аналогичный номер детали - DAC3482_14 |
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Аналогичное описание - DAC3482_14 |
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