 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
DAC7678 датащи(PDF) 2 Page - Texas Instruments |
|
||||||||||||||||||||||||||||||
DAC7678 датащи(HTML) 2 Page - Texas Instruments |
|
|
2 / 53 page  DAC7678 SBAS493A – FEBRUARY 2010 – REVISED AUGUST 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MAXIMUM MAXIMUM MAXIMUM SPECIFIED PACKAGE- PACKAGE PACKAGE PRODUCT RELATIVE DIFFERENTIAL REFERENCE DRIFT TEMPERATURE LEAD DESIGNATOR MARKING ACCURACY (LSB) NONLINEARITY (LSB) (ppm/°C) RANGE TSSOP-16 PW DAC7678 ±1 ±0.25 25 –40°C to +125°C DAC7678 QFN-24 RGE (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. DAC7678 UNIT AVDD to GND –0.3 to +6 V Digital input voltage to GND –0.3 to +AVDD + 0.3 V VOUT to GND –0.3 to +AVDD + 0.3 V VREFIN/VREFOUT to GND –0.3 to +AVDD + 0.3 V Operating temperature range –40 to +125 °C Storage temperature range –65 to +150 °C Junction temperature range (TJ max) +150 °C Power dissipation (TJ max – TA)/qJA W (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. THERMAL INFORMATION DAC7678 THERMAL METRIC(1) UNITS PW (16 PINS) RGE (24 PINS) qJA Junction-to-ambient thermal resistance 111.9 33.7 qJCtop Junction-to-case (top) thermal resistance 33.3 16.9 qJB Junction-to-board thermal resistance 52.4 7.4 °C/W yJT Junction-to-top characterization parameter 2 0.5 yJB Junction-to-board characterization parameter 51.2 7.1 qJCbot Junction-to-case (bottom) thermal resistance n/a 1.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): DAC7678 |
Аналогичный номер детали - DAC7678_14 |
|
Аналогичное описание - DAC7678_14 |
|
|
ссылки URL |
| Конфиденциальность |
| ALLDATASHEETRU.COM |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
