поискавой системы для электроныых деталей |
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LM2734Z датащи(PDF) 3 Page - Texas Instruments |
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LM2734Z датащи(HTML) 3 Page - Texas Instruments |
3 / 29 page LM2734Z www.ti.com SNVS334D – JANUARY 2005 – REVISED JUNE 2008 PIN DESCRIPTIONS (continued) Pin Name Function 4 EN Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3V. 5 VIN Input supply voltage. Connect a bypass capacitor to this pin. 6 SW Output switch. Connects to the inductor, catch diode, and bootstrap capacitor. DAP GND The Die Attach Pad is internally connected to GND These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VIN -0.5V to 24V SW Voltage -0.5V to 24V Boost Voltage -0.5V to 30V Boost to SW Voltage -0.5V to 6.0V FB Voltage -0.5V to 3.0V EN Voltage -0.5V to (VIN + 0.3V) Junction Temperature 150°C ESD Susceptibility (2) 2kV Storage Temp. Range -65°C to 150°C Soldering Information Infrared/Convection Reflow (15sec) 220°C Wave Soldering Lead Temp. (10sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see Electrical Characteristics. (2) Human body model, 1.5k Ω in series with 100pF. OPERATING RATINGS (1) VIN 3V to 20V SW Voltage -0.5V to 20V Boost Voltage -0.5V to 25V Boost to SW Voltage 1.6V to 5.5V Junction Temperature Range −40°C to +125°C Thermal Resistance θJA (2) TSOT23–6 118°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see Electrical Characteristics. (2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air, θJA = 204°C/W. Copyright © 2005–2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2734Z |
Аналогичный номер детали - LM2734Z_14 |
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Аналогичное описание - LM2734Z_14 |
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