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LM2734Z датащи(PDF) 3 Page - Texas Instruments

номер детали LM2734Z
подробное описание детали  Thin SOT23 1A Load Step-Down DC-DC Regulator
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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LM2734Z датащи(HTML) 3 Page - Texas Instruments

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LM2734Z
www.ti.com
SNVS334D – JANUARY 2005 – REVISED JUNE 2008
PIN DESCRIPTIONS (continued)
Pin
Name
Function
4
EN
Enable control input. Logic high enables operation. Do not allow this pin to
float or be greater than VIN + 0.3V.
5
VIN
Input supply voltage. Connect a bypass capacitor to this pin.
6
SW
Output switch. Connects to the inductor, catch diode, and bootstrap
capacitor.
DAP
GND
The Die Attach Pad is internally connected to GND
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
VIN
-0.5V to 24V
SW Voltage
-0.5V to 24V
Boost Voltage
-0.5V to 30V
Boost to SW Voltage
-0.5V to 6.0V
FB Voltage
-0.5V to 3.0V
EN Voltage
-0.5V to (VIN + 0.3V)
Junction Temperature
150°C
ESD Susceptibility (2)
2kV
Storage Temp. Range
-65°C to 150°C
Soldering Information
Infrared/Convection Reflow (15sec)
220°C
Wave Soldering Lead Temp. (10sec)
260°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see Electrical Characteristics.
(2)
Human body model, 1.5k
Ω in series with 100pF.
OPERATING RATINGS
(1)
VIN
3V to 20V
SW Voltage
-0.5V to 20V
Boost Voltage
-0.5V to 25V
Boost to SW Voltage
1.6V to 5.5V
Junction Temperature Range
−40°C to +125°C
Thermal Resistance
θJA
(2)
TSOT23–6
118°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see Electrical Characteristics.
(2)
Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA
and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still
air,
θJA = 204°C/W.
Copyright © 2005–2008, Texas Instruments Incorporated
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