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LM3687 датащи(PDF) 5 Page - Texas Instruments

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номер детали LM3687
подробное описание детали  Step-Down DC-DC Converter with Integrated Low Dropout Regulator and Startup Mode
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

LM3687 датащи(HTML) 5 Page - Texas Instruments

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LM3687
www.ti.com
SNVS473A – DECEMBER 2007 – REVISED JULY 2008
Output Voltage Option
Order Number
Package Marking
Supplied as
Flow
VOUT_DCDC
VOUT_LIN
250 units, tape and reel,
NOPB
LM3687TL-1812
SB
lead free
1.80V
1.20V
3000 units, tape and reel,
NOPB
LM3687TLX-1812
SB
lead free
250 units, tape and reel,
NOPB
LM3687TL-1813
tbd
lead free
1.80V *
1.30V *
3000 units, tape and reel,
NOPB
LM3687TLX-1813
tbd
lead free
* For availability or other output voltage combinations please contact your local NSC sales office
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
VIN_LIN, VBATT pins: Voltage to GND,
VIN_LIN≤ VBATT
-0.2V to 6.0V
VIN_LIN pin to VBATT pin
0.2V
Enable pins,
(GND-0.2V) to
Feedback pin,
(VBATT+0.2V) with
SW pin
6.0V max
Continuous Power Dissipation(3)
Internally Limited
Junction Temperature (TJ-MAX )
150°C
Storage Temperature Range
-65°C to + 150°C
Package Peak Reflow Temperature (Pb-free, 10-20 sec.) (4)
260°C
ESD Rating (5)
Human Body Model:
2.0kV
Machine Model
200V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the SGND pin.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and
disengages at TJ = 140°C (typ.).
(4)
For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer
Level Chip Scale Package (AN-1112).
(5)
The Human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin. (MIL-STD-883 3015.7)
Operating Ratings
(1) (2)
Input Voltage Range VBATT
2.7V to 5.5V
(3)
(
≥VOUT_LIN(NOM) + 1.5V and
≥VOUT_DCDC(NOM) + 1.0V)
Input Voltage Range VIN_LIN
(VOUT_LIN(NOM) + 0.25V) to 4.5V
Junction Temperature (TJ) Range
-30°C to + 125°C
Ambient Temperature (TA) Range
-30°C to + 125°C
(4)
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the SGND pin.
(3)
The battery input voltage range recommended for ideal applications performance for the specified output voltages is given as follows:
VBATT = 2.7V to 5.5V for 1.0V < VOUT_DCDC < 1.8V;
VBATT = (VOUT_DCDC +1V) to 5.5V for 1.8V ≤ VOUT_DCDC ≤ 1.875V
(4)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Copyright © 2007–2008, Texas Instruments Incorporated
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