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AMC7832IPAP датащи(PDF) 6 Page - Texas Instruments

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номер детали AMC7832IPAP
подробное описание детали  AMC7832 12-Bit Analog Monitor and Control Solution with Multi-Channel ADC, Bipolar DACs, Temperature Sensor and GPIO Ports
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

AMC7832IPAP датащи(HTML) 6 Page - Texas Instruments

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AMC7832
SLAS836 – MARCH 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
AVDD to GND
-0.3
+6
V
DVDD to GND
-0.3
+6
V
IOVDD to GND
-0.3
DVDD
V
AVCC to GND
-0.3
+18
V
Supply voltage range
AVEE to GND
-13
+0.3
V
AVSSA,B,C,D to AVEE
-0.3
+13
V
AVCC to AVSSA,B,C,D
-0.3
+26
V
AVCC to AVEE
-0.3
+26
V
DGND to AGND
-0.3
+0.3
V
ADC_[0-11] analog input voltage to GND
–13
+13
V
ADC_[0-11] analog input current
-10
+10
mA
LV_ADC[12-16] analog input voltage to GND
-0.3
AVDD + 0.3
V
LV_ADC[12-16] analog input current
-10
+10
mA
DAC outputs to GND
AVSS - 0.3
AVCC + 0.3
V
REF_CMP to GND
-0.3
AVDD + 0.3
V
Terminal voltage/
Current range
REF_OUT[1-2] to GND
-0.3
AVDD + 0.3
V
VRANGE[A-D] to GND
-0.3
AVDD + 0.3
V
CS, SCLK, SDI and RESET to GND
-0.3
IOVDD + 0.3
V
SDO to GND
-0.3
IOVDD + 0.3
V
GPIO[0-7] to GND
-0.3
IOVDD + 0.3
V
GPIO[0-7] sinking current
5
mA
Operating temperature range
-40
+125
°C
Junction temperature range (TJ max)
-40
+150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
PARAMETER
DEFINITION
MIN
MAX
UNIT
Tstg
Storage temperature range
-40
+150
°C
Human body model (HBM) ESD stress voltage(2)
2.0
kV
VESD
(1)
Charged device model (CDM) ESD stress voltage(3)
750
V
(1)
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2)
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3)
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
6
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Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: AMC7832


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