SUBMINIATURE T-3/4 LED

DIFFUSED and CLEAR LAMPS

.010 (.26)

.002 (.06)

.056 (1.44)

.048 (1.24)

.024 (.6)

.016 (.4)

.091 (2.3)

.083 (2.1)

.020 (.5)

.012 (.3)

.276 (7.0)

MIN

.058 (1.48)

.050 (1.28)

.087 (2.2)

.079 (2.0)

.031 (.78)

.023 (.58)

CATHODE MARK

(COLOR STRIPE ON SIDE OF PACKAGE)

.075 (1.9)

.063 (1.6)

DIA

PACKAGE DIMENSIONS

HIGH EFF. RED

HLMP-6305A

Water Clear

MV6700A

Red Diffused

YELLOW

HLMP-6405A

Water Clear

MV6300A

Yellow Diffused

GREEN

HLMP-6505A

Water Clear

MV6400A

Green Diffused

AIGaAs RED

HLMP-Q105A

Water Clear

HLMP-Q150A

Red Diffused

NOTES:

ALL DIMENSIONS ARE IN INCHES (mm).

DESCRIPTION

These T-3/4 subminiature LED lamps feature a square-base,

transfer molded package for surface mount applications. A tinted

diffused or water clear epoxy lens



 available in AIGaAs red,

high-efficiency red, green, and yellow



 produces wide-angle

beam emission and sharp on/off contrast. They are available with

gullwing lead bends for top mounting, as well as yoke lead bends

and Z-bends for mounting to the back of a PCB.

FEATURES

• Subminiature T-3/4 transfer molded

• Low package profile

• Axial leads

• Wide viewing angle

• SMT versions

Parameter

HLMP-6305A

HLMP-6405A

HLMP-6505A

HLMP-Q105A

UNITS

MV6700A

MV6300A

MV6400A

HLMP-Q150A

Power Dissipation

135

85

135

85

mW

Average Forward Current

30

20

30

30

mA

Peak Forward Current

(1

µS pulsewidth, 0.1% DF)

90

60

90

300

mA

Lead Soldering Time at 260

° C

5555

sec

Operating Temperature

-55 to +100

-55 to +100

-50 to +100

-20 to +100

°C

Storage Temperature

-55 to +100

-55 to +100

-50 to +100

-20 to +100

°C



 2001 Fairchild Semiconductor Corporation

DS300000

2/27/01

1 OF 5

www.fairchildsemi.com