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CD4006BMS

Chip Dimensions and Pad Layout

FIGURE 7. TYPICAL DYANAMIC POWER DISSIPATION

AS A FUNCTION OF CLOCK FREQUENCY

8

6

4

28

6

4

22

INPUT FREQUENCY (fCL) (kHz)

110

8

6

4

28

6

4

26

4

8

6

4

2

8

6

4

2

8

6

4

2

8

6

4

2

10

SUPPLY VOLTAGE (VDD) = 15V

10V

5V

10V

CL = 15pF

CL = 50pF

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches