www.irf.com

1

5/5/06

DirectFET

™ Power MOSFET ‚

DirectFET

™ ISOMETRIC

ST

Fig 1. Typical On-Resistance Vs. Gate Voltage

Typical values (unless otherwise specified)

Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

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SQ

SX

ST

MQ

MX

MT

Description

achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET

package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-

red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and pro-

cesses. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best

thermal resistance by 80%.

The IRF6614PbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction

and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest

generation of processors operating at higher frequencies. The IRF6614PbF has been optimized for parameters that are critical in

synchronous buck operating from 12 volt bus converters including Rds(on) and gate charge to minimize losses in the control FET

socket.

2.0

4.0

6.0

8.0

10.0

VGS, Gate-to-Source Voltage (V)

4

8

12

16

20

TJ = 25°C

TJ = 125°C

ID = 12.7A

0

102030

4050

QG Total Gate Charge (nC)

0

2

4

6

8

10

12

VDS= 32V

VDS= 20V

ID= 10.2A

40V max ±20V max 5.9m

Ω@ 10V 7.1mΩ@ 4.5V

Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage

19nC

6.0nC

1.4nC

5.5nC

9.5nC

1.8V

Notes:

Absolute Maximum Ratings

Parameter

Units

Drain-to-Source Voltage

V

Gate-to-Source Voltage

e

e

A

f

Pulsed Drain Current

g

Single Pulse Avalanche Energy

h

mJ

Avalanche Current

Ãg

A

10.2

Max.

10.1

55

102

±20

40

12.7

22

PD -97090

IRF6614PbF

IRF6614TRPbF

l RoHS Compliant

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l Dual Sided Cooling Compatible

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l Compatible with existing Surface Mount Techniques

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