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LM3643 датащи(PDF) 4 Page - Texas Instruments |
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LM3643 датащи(HTML) 4 Page - Texas Instruments |
4 / 39 page LM3643, LM3643A SNVS967A – AUGUST 2014 – REVISED NOVEMBER 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT IN, SW, OUT, LED1, LED2 −0.3 6 V SDA, SCL, TX, TORCH/TEMP, HWEN, STROBE −0.3 to the lesser of (VIN+0.3) w/ 6 V max Continuous power dissipation(3) Internally limited Junction temperature (TJ-MAX) 150 °C Maximum lead temperature (soldering) Note (4) (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND terminal. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 135°C (typ.). Thermal shutdown is ensured by design. (4) For detailed soldering specifications and information, please refer to TI Application Note DSBGA Wafer Level Chip Scale Package (SNVA009). 8.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all −2500 2500 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification −1500 1500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN 2.5 5.5 V Junction temperature (TJ) −40 125 °C Ambient temperature (TA) (3) −40 85 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND terminal. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 8.4 Thermal Information LM3643 THERMAL METRIC(1) DSBGA UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 67.8 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LM3643 LM3643A |
Аналогичный номер детали - LM3643 |
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Аналогичное описание - LM3643 |
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