BUK6E2R0-30C

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Product data sheet

Rev. 02 — 7 September 2010

11 of 15

NXP Semiconductors

BUK6E2R0-30C

N-channel TrenchMOS intermediate level FET

7.

Package outline

Fig 17. Package outline SOT226 (I2PAK)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT226

TO-262

D

L

12

3

mounting

base

e

e

Q

b

05

10 mm

scale

Plastic single-ended package (I2PAK); low-profile 3-lead TO-262

SOT226

DIMENSIONS (mm are the original dimensions)

A

E

c

UNIT

eQ

mm

2.54

2.6

2.2

3.30

2.79

15.0

13.5

10.3

9.7

1.6

1.2

11

0.7

0.4

1.3

1.0

0.85

0.60

1.40

1.27

4.5

4.1

Ab

D

max

c

E

L

06-02-14

09-08-25