UC1845A-SP

SLUSC14 – MAY 2015

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8 Specifications

8.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, low-impedance source

30

V

–0.3

6.3

V

Supply current

Self limiting

Output current

±1

A

Error amplifier output sink current

10

mA

Output energy (capacitive load)

5

μJ

1

W

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground. Currents are positive in, negative out of the specified terminal.

8.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

12

25

V

Sink/source output current (continuous or time average)

0

200

mA

Reference load current

0

20

mA

8.4 Thermal Information

UC1845A-SP

JG (CDIP)

FK (LCCC)

HKU (CFP)

UNIT

8 PINS

20 PINS

10 PINS

Junction-to-ambient thermal resistance

103

—

51.9

°C/W

Junction-to-case (bottom) thermal resistance

9.6

9.0

6.6

°C/W

Junction-to-board thermal resistance

69.2

—

31.5

°C/W

Junction-to-top characterization parameter

13.9

—

5.42

°C/W

Junction-to-board characterization parameter

73

—

31

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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