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TDC1011QPWRQ1 датащи(PDF) 4 Page - Texas Instruments |
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TDC1011QPWRQ1 датащи(HTML) 4 Page - Texas Instruments |
4 / 49 page TDC1011-Q1 SNAS670 – JULY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD Analog supply voltage, VDD pins –0.3 6.0 V VIO I/O supply voltage (VIO must always be lower than or equal to VDD supply) –0.3 6.0 V VI Voltage on any analog input pin(3) –0.3 VDD + 0.3 V VI Voltage on any digital input pin(3) –0.3 VIO + 0.3 V II Input current at any pin 5 mA TJ Operating junction temperature –40 125 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) When the input voltage at a pin exceeds the power supplies, the current at that pin must not exceed 5 mA and the voltage (VI) at that pin must not exceed 6.0 V. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC A100-002(1) ±2000 All pins ±500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Corner pins (1, 14, 15 Q100-011 ±750 and 28) (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Analog supply voltage, VDD pins 2.7 5.5 V VIO Digital supply voltage, (VIO must always be lower than or equal to VDD supply) 1.8 VDD V VI Voltage on any analog input pin GND VDD V VI Voltage on any digital input pin GND VIO V ƒCLKIN Operating frequency 0.06 16 MHz TJ Operating junction temperature –40 125 °C 6.4 Thermal Information (1) TDC1011 THERMAL METRIC TSSOP UNIT PW (28 PINS) RθJA Junction-to-ambient thermal resistance 83.5 RθJC(top) Junction-to-case (top) thermal resistance 29.9 RθJB Junction-to-board thermal resistance 40.8 °C/W ψJT Junction-to-top characterization parameter 2.4 ψJB Junction-to-board characterization parameter 40.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TDC1011-Q1 |
Аналогичный номер детали - TDC1011QPWRQ1 |
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Аналогичное описание - TDC1011QPWRQ1 |
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