TEA1723AT

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2.1 — 7 June 2012

10 of 14

NXP Semiconductors

TEA1723AT

HV start-up flyback controller with integrated MOSFET for 11 W

9.

Package outline

Fig 3.

Package outline SOT1175-1 (SO7)

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT1175-1

- - -

- - -

- - -

sot1175-1_po

10-03-30

10-04-21

Unit

mm

max

nom

min

1.75 0.250

0.175

0.100

0.25

0.49

0.40

0.36

5.0

4.9

4.8

A

Dimensions

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

1.45

1.35

1.25

1.0

0.7

0.4

0.70

0.67

0.60

0.25

Qv

c

0.25

0.20

0.19

DE

4.0

3.9

3.8

e

1.27

1.05

6.2

6.0

5.8

L

0.1

0.7

0.5

0.3

yZ

θ

0.25

w

2.5

0

5 mm

scale

SO7: plastic small outline package; 7 leads; body width 3.9 mm

SOT1175-1

y

D

Q

A

θ

detail X

L

X

E

A

vA

c

pin 1 index

Z

e

w

4

1

75