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LM3677 датащи(PDF) 3 Page - Texas Instruments

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номер детали LM3677
подробное описание детали  3MHz, 600mA Miniature Step-Down DC-DC Converter for Ultra Low Voltage Circuits
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LM3677 датащи(HTML) 3 Page - Texas Instruments

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LM3677
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SNVS502F – MARCH 2007 – REVISED MAY 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributor for
availability and specifications.
VIN Pin: Voltage to GND
−0.2V to 6.0V
FB, SW, EN Pin:
(GND
−0.2V) to
(VIN + 0.2V)
Continuous Power Dissipation (3)
Internally Limited
Junction Temperature (TJ-MAX)
+125°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
260°C
(Soldering, 10 sec.)
ESD Rating (4)
Human Body Model: All Pins
2.0 kV
Machine Model: All Pins
200V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and
disengages at TJ= 130°C (typ.).
(4)
The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
OPERATING RATINGS
(1), (2)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
0 mA to 600 mA
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
(3)
−30°C to +85°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have
to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the
maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA)
in the application, as given by the following equation: TA-MAX= TJ-MAX− (θJAx PD-MAX). Refer to Dissipation rating table for PD-MAX values
at different ambient temperatures.
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (
θJA)
(1)
85°C/W
(1)
Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation
exists, special care must be given to thermal dissipation issues in board design. Value specified here 85 °C/W is based on
measurement results using a 4 layer board as per JEDEC standards.
Copyright © 2007–2013, Texas Instruments Incorporated
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