LM10

SNOSBH4E – MAY 1998 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2) (3)

MIN

MAX

UNIT

LM10/LM10B/LM10C

45

V

Total supply voltage

LM10BL/LM10CL

7

V

LM10/LM10B/LM10C

±40

V

LM10BL/LM10CL

±7

V

Internally limited

Continuous

TO

Soldering (10 seconds)

300

°C

Soldering (10 seconds)

260

°C

Lead temperature

DIP

Vapor phase (60 seconds)

215

°C

Infrared (15 seconds)

220

°C

LM10

150

°C

Maximum junction

LM10B

100

°C

temperature

LM10C

85

°C

−55

150

°C

(1)

Refer to RETS10X for LM10H military specifications.

(2)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

The Input voltage can exceed the supply voltages provided that the voltage from the input to any other terminal does not exceed the

(5)

The maximum, operating-junction temperature is 150°C for the LM10, 100°C for the LM10B(L) and 85°C for the LM10C(L). At elevated

temperatures, devices must be derated based on package thermal resistance.

(6)

Internal thermal limiting prevents excessive heating that could result in sudden failure, but the IC can be subjected to accelerated stress

with a shorted output and worst-case conditions.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply input voltage range (V–) – (V+)

1.2

40

V

Common-mode voltage

(V–)

(V+) – 0.85

V

Reference voltage

0.2

V

Reference current

0

1

mA

6.3 Thermal Information

LM10

NEV (SDIP)

NPA (SOIC)

P (PDIP)

UNIT

8 PINS

14 PINS

8 PINS

Junction-to-ambient thermal resistance

150

90

87

°C/W

Junction-to-case (top) thermal resistance

45

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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