AMC1204, AMC1204B

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SBAS512E – APRIL 2011 – REVISED SEPTEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

Over the operating ambient temperature range, unless otherwise noted.

(1)

MIN

MAX

UNIT

Supply voltage, AVDD to AGND or DVDD to DGND

–0.3

6

V

Analog input voltage at VINP, VINN

AGND – 0.5

AVDD + 0.5

V

Digital input voltage at CLKIN

DGND – 0.3

DVDD + 0.3

V

Input current to any pin except supply pins

–10

10

mA

150

°C

–40

125

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics

is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per JEDEC standard 22, test method A114-

±3000

Electrostatic discharge

Charged-device model (CDM), per JEDEC standard 22, test method

V

±1500

Machine model (MM), per JEDEC standard 22, test method A115A

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating ambient temperature

–40

105

°C

AVDD

High-side (analog) supply voltage

4.5

5

5.5

V

DVDD

Controller-side (digital) supply voltage

2.7

3.3

5.5

V

6.4 Thermal Information

AMC1204, AMC1204B

DW (SOIC)

DWV (SOIC)

UNIT

16 PINS

8 PINS

Junction-to-ambient thermal resistance

78.5

106.5

°C/W

Junction-to-case (top) thermal resistance

41.3

53.6

°C/W

Junction-to-board thermal resistance

50.2

60.3

°C/W

Junction-to-top characterization parameter

11.5

18.5

°C/W

Junction-to-board characterization parameter

41.2

58.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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