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AMC1304M05DWR датащи(PDF) 5 Page - Texas Instruments |
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AMC1304M05DWR датащи(HTML) 5 Page - Texas Instruments |
5 / 39 page AMC1304L05, AMC1304L25, AMC1304M05, AMC1304M25 www.ti.com SBAS655C – SEPTEMBER 2014 – REVISED SEPTEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over the operating ambient temperature range (unless otherwise noted) (1) PARAMETER MIN MAX UNIT Supply voltage DVDD to DGND –0.3 6.5 V LDO input voltage LDOIN to AGND –0.3 26 V Analog input voltage at AINP, AINN AGND – 6 3.7 V Digital input voltage at CLKIN, CLKIN_N DGND – 0.3 DVDD + 0.3 V Input current to any pin except supply pins –10 10 mA Maximum virtual junction, TJ 150 °C Temperature Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Operating ambient temperature range –40 125 °C LDOIN LDO input supply voltage (LDOIN pin) 4.0 15.0 18.0 V DVDD Digital (controller-side) supply voltage (DVDD pin) 3.0 3.3 5.5 V 7.4 Thermal Information AMC1304x THERMAL METRIC (1) DW (SOIC) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 80.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 40.5 °C/W RθJB Junction-to-board thermal resistance 45.1 °C/W ψJT Junction-to-top characterization parameter 11.9 °C/W ψJB Junction-to-board characterization parameter 44.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: AMC1304L05 AMC1304L25 AMC1304M05 AMC1304M25 |
Аналогичный номер детали - AMC1304M05DWR |
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Аналогичное описание - AMC1304M05DWR |
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