AMC1304L05, AMC1304L25, AMC1304M05, AMC1304M25

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SBAS655C – SEPTEMBER 2014 – REVISED SEPTEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over the operating ambient temperature range (unless otherwise noted)

(1)

PARAMETER

MIN

MAX

UNIT

Supply voltage

DVDD to DGND

–0.3

6.5

V

LDO input voltage

LDOIN to AGND

–0.3

26

V

Analog input voltage at AINP, AINN

AGND – 6

3.7

V

Digital input voltage at CLKIN, CLKIN_N

DGND – 0.3

DVDD + 0.3

V

Input current to any pin except supply pins

–10

10

mA

150

°C

Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating ambient temperature range

–40

125

°C

LDOIN

LDO input supply voltage (LDOIN pin)

4.0

15.0

18.0

V

DVDD

Digital (controller-side) supply voltage (DVDD pin)

3.0

3.3

5.5

V

7.4 Thermal Information

AMC1304x

DW (SOIC)

UNIT

16 PINS

Junction-to-ambient thermal resistance

80.2

°C/W

Junction-to-case (top) thermal resistance

40.5

°C/W

Junction-to-board thermal resistance

45.1

°C/W

Junction-to-top characterization parameter

11.9

°C/W

Junction-to-board characterization parameter

44.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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