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UC1846-SP датащи(PDF) 6 Page - Texas Instruments |
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UC1846-SP датащи(HTML) 6 Page - Texas Instruments |
6 / 29 page UC1846-SP SLUS871C – JANUARY 2009 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC Supply voltage 40 V Collector supply voltage 40 V VI Analog input voltage (C/S-, C/S+, E/A+, E/A-, Shutdown) –0.3 VIN V IO Output current, source or sink 500 mA Reference output current –30 mA Sync output current –5 mA Error amplifier output current –5 mA Soft-start sink current 50 mA Oscillator charging current 5 mA TJ(max) Maximum junction temperature 150 °C Tlead Lead temperature (soldering, 10 s) 300 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground. Currents are positive into, negative out of the specified terminal. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TJ Operating junction temperature –55 125 °C 6.4 Thermal Information UC1846-SP THERMAL METRIC(1) J (CDIP) W (CFP) FK (LCCC) UNIT 16 PINS 16 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 104.2 105.2 N/A °C/W RθJC(top) Junction-to-case (top) thermal resistance N/A N/A N/A °C/W RθJB Junction-to-board thermal resistance 36.6 96.8 N/A °C/W ψJT Junction-to-top characterization parameter 25.0 24.0 N/A °C/W ψJB Junction-to-board characterization parameter 27.9 82.6 N/A °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.2 8.5 9.0 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: UC1846-SP |
Аналогичный номер детали - UC1846-SP_15 |
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Аналогичное описание - UC1846-SP_15 |
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