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UC1846-SP датащи(PDF) 6 Page - Texas Instruments

номер детали UC1846-SP
подробное описание детали  Current-Mode PWM Controller
Download  29 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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UC1846-SP датащи(HTML) 6 Page - Texas Instruments

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UC1846-SP
SLUS871C – JANUARY 2009 – REVISED OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC
Supply voltage
40
V
Collector supply voltage
40
V
VI
Analog input voltage (C/S-, C/S+, E/A+, E/A-, Shutdown)
–0.3
VIN
V
IO
Output current, source or sink
500
mA
Reference output current
–30
mA
Sync output current
–5
mA
Error amplifier output current
–5
mA
Soft-start sink current
50
mA
Oscillator charging current
5
mA
TJ(max)
Maximum junction temperature
150
°C
Tlead
Lead temperature (soldering, 10 s)
300
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground. Currents are positive into, negative out of the specified terminal.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TJ
Operating junction temperature
–55
125
°C
6.4 Thermal Information
UC1846-SP
THERMAL METRIC(1)
J (CDIP)
W (CFP)
FK (LCCC)
UNIT
16 PINS
16 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
104.2
105.2
N/A
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
N/A
N/A
N/A
°C/W
RθJB
Junction-to-board thermal resistance
36.6
96.8
N/A
°C/W
ψJT
Junction-to-top characterization parameter
25.0
24.0
N/A
°C/W
ψJB
Junction-to-board characterization parameter
27.9
82.6
N/A
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.2
8.5
9.0
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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Product Folder Links: UC1846-SP


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