TS5A3160

SCDS216D – OCTOBER 2005 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.5

6.5

V

–0.5

V

Analog port diode current

–50

mA

On-state switch current

–200

200

mA

–400

400

–0.5

6.5

V

Digital input clamp current

–50

mA

100

mA

Continuous current through GND

–100

mA

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum

(3)

All voltages are with respect to ground, unless otherwise specified.

(4)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(5)

This value is limited to 5.5 V maximum.

(6)

Pulse at 1-ms duration < 10% duty cycle

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Switch input/output voltage

0

V

V+

Supply voltage

1.65

5.5

V

Control input voltage

0

5.5

V

Operating temperature

–40

85

°C

6.4 Thermal Information

TS5A3160

DBV (SOT-23)

DCK (SC-70)

UNIT

6 PINS

6 PINS

Junction-to-ambient thermal resistance

165

259

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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