DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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August 6, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200048U

Table 1. SMP1321 Series Packaging and Marking

Common Anode

Series Pair

Low Inductance

Single

Single

SOT-23

SOT-23

SOT-23

SC-79

Green™

SOD-882

Green™

SMP1321-003

Marking: PM9

♦SMP1321-005

Marking: PM2

SMP1321-007

Marking: PMB

SMP1321-003LF

Green™

Marking: RM9

♦SMP1321-005LF

Green™

Marking: RM2

SMP1321-007LF

Green™

Marking: RMB

SMP1321-079LF

Marking: Cathode and C6

SMP1321-040LF

Marking: C

The Pb-free symbol or “LF” in the part number denotes a lead-free, RoHS-compliant package unless otherwise noted as Green™.

Tin/lead (Sn/Pb) packaging is not recommended for new designs.

SMP1321-007

For the -007 configuration of the SOT-23 package, the package

inductance is effectively reduced to 0.4 nH compared to the

1.5 nH value of the standard configuration. This lower inductance

is particularly beneficial when the diodes are used as shunt

connected switches at frequencies higher than 500 MHz in which

inductance is the primary limitation on maximum switch isolation.

To achieve the effective 0.4 nH, the SOT-23 package must be

inserted in the microstrip circuit board with a gap in the trace, as

shown in Figure 1. Because of the polarity of the diode junction,

this low inductance feature is realizable only with the cathode

connected to ground.

Ground

Gap

S1650

Figure 1. SOT-23 Package Trace Gap

Electrical and Mechanical Specifications

The part number and configuration for the SMP1321 series are

provided in Table 1. The absolute maximum ratings of the

SMP1321 series are provided in Table 2. Electrical specifications

are provided in Table 3. Resistance versus temperature

measurements are provided in Table 4.

Typical performance characteristics of the SMP1321 series are

illustrated in Figures 2 to 5.

Package Dimensions

Package dimensions are shown in Figures 6 to 10 (even

numbers), and tape and reel dimensions are provided in Figures 7

to 11 (odd numbers).

Package and Handling Information

Instructions on the shipping container label regarding exposure to

moisture after the container seal is broken must be followed.

Otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

The SMP1321 series is rated to Moisture Sensitivity Level 1

(MSL1) at 260

C. It can be used for lead or lead-free soldering.

For additional information, refer to the Skyworks Application Note,

Solder Reflow Information, document number 200164.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.