TDC1000PWR datasheet(5/60 Pages) TI1

номер детали	TDC1000PWR

подробное описание детали	TDC1000 Ultrasonic Sensing Analog Front End (AFE) for Level Sensing, Flow Sensing, Concentration Sensing, and Proximity Sensing Applications

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TDC1000, TDC1000-Q1

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SNAS648B – OCTOBER 2014 – REVISED AUGUST 2015

6.4 Thermal Information

(1)

TDC1000

THERMAL METRIC

TSSOP

UNIT

(28 PINS) PW

RθJA

Junction-to-ambient thermal resistance

83.5

RθJC(top) Junction-to-case (top) thermal resistance

29.9

RθJB

Junction-to-board thermal resistance

40.8

°C/W

ψJT

Junction-to-top characterization parameter

2.4

ψJB

Junction-to-board characterization parameter

40.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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