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UC3173A датащи(PDF) 2 Page - Texas Instruments

номер детали UC3173A
подробное описание детали  Full Bridge Power Amplifier
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UC3173A датащи(HTML) 2 Page - Texas Instruments

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UC3173A
Input Supply Voltage, (VIN, VC, VL) . . . . . . . . . . . . . . . . . . 20V
UV Comparator
Maximum Forced Voltage . . . . . . . . . . . . . . . .
−0.3V to 10V
Maximum Forced Current . . . . . . . . . . . . . . . . . . . . .
± 10mA
B Amplifier Inverting Input . . . . . . . . . . . . . .
−0.3V to VIN + 1.0
A Amplifier Inverting Inputs,
(Aux. and Normal) . . . . . . . . . . . . . . . . .
−0.3V to VC + 1.0V
Open Collector Output Voltages . . . . . . . . . . . . . . . . . . . . . 20V
A and B Output Currents (Continuous)
Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6A
Parking Drive Output Current
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mA
Pulsed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
Output Diode Current (Pulsed) . . . . . . . . . . . . . . . . . . . . . . 0.6A
Power OK Output Current (Continuous) . . . . . . . . . . . . . . 30mA
Operating Junction Temperature . . . . . . . . . .
−55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . .
−65°C to +150°C
Lead Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300
°C
Note 1: Unless otherwise indicated, voltages are referenced to
ground and currents are positive into, negative out of, the speci-
fied terminals, “Pulsed” is defined as a less than 10% duty cycle
pulse with a maximum duration of 500
µs.
ABSOLUTE MAXIMUM RATINGS (Note 1)
DW Package:
Thermal Resistance Junction to Leads,
θjl . . . . . . . . 35°C/W
Thermal Resistance Junction to Ambient,
θja . . . . 60-70°C/W
FQ Package:
Thermal Resistance Junction to Leads,
θjl . . . . . . . . . 60°C/W
Thermal Resistance Junction to Ambient,
θja . . 110-120°C/W
QP Package:
Thermal Resistance Junction to Leads,
θjl . . . . . . . . . 15°C/W
Thermal Resistance Junction to Ambient,
θja . . . . 30-40°C/W
Note 2: The above numbers for
θjl are maximums for the limiting
thermal resistance of the package in a standard mounting con-
figuration. The
θja numbers are meant to be guide lines for the
thermal performance of the device/pc-board system. All of the
above numbers assume no ambient airflow.
Note 3: Consult Packaging Section of Unitrode Integrated Cir-
cuits databook for thermal specifications and limitations of pack-
ages.
THERMAL DATA
SOIC-24 (Top View)
DW Package
PLCC-28 (Top View)
QP Package
48
47
46
45
1
44
43
42
41
40
39
38
37
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
N/C
N/C
VIN
BIN
N/C
N/C
PRKDRV
PWROK
REFIN
N/C
N/C
N/C
BOUT
BOUT
N/C
N/C
N/C
AOUT
AOUT
N/C
N/C
N/C
AIN
VC
RANGE
CS+
COMP
VPARK
N/C
GND
CSOUT
VL
INH
N/C
UV1
UV2
PARK
PGND
N/C
PGND
CS–
N/C
N/C
N/C
N/C
N/C
N/C
N/C
CONNECTION DIAGRAMS
TQFP-48 (Top View)
FQ Package


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