GND

V

CC

1

2

6

3

5

4

I

1

O

IO4

IO3

IO2

TPD4E001-Q1

www.ti.com

SLLSEG0D – MARCH 2013 – REVISED AUGUST 2015

5 Pin Configuration and Functions

DBV Package

6-Pin SOT-23

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

GND

2

GND

Ground

IO1

1

IO2

3

I/O

ESD-protected channel

IO3

4

IO4

6

5

I

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

7

V

I/O voltage tolerance

–0.3

V

5.5

A

100

W

Free air operating temperature

–40

125

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the

specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Non-repetitive current pulse 8/20 µs exponentially decaying waveform according to IEC 61000-4-5.

6.2 ESD Ratings: AEC Q100

VALUE

UNIT

±15000

Electrostatic

V

discharge

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings: IEC 61000-4-2

VALUE

UNIT

IEC 61000-4-2 contact discharge

±8000

Electrostatic discharge

V

IEC 61000-4-2 air-gap discharge

±15000

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