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UCS1003-3-BP датащи(PDF) 5 Page - Microchip Technology

номер детали UCS1003-3-BP
подробное описание детали  USB Port Power Controller with Charger Emulation
Download  138 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

UCS1003-3-BP датащи(HTML) 5 Page - Microchip Technology

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 2014-2015 Microchip Technology Inc.
DS20005346B-page 5
UCS1003-1/2/3
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings
Voltage on VDD, VS and VBUS Pins....................................................................................................................-0.3 to 6V
Pull-up Voltage (VPULLUP) .................................................................................................................... -0.3 to VDD + 0.3V
Data Switch Current (IHSW_ON), Switch On...........................................................................................................±50 mA
Port Power Switch Current .................................................................................................................... Internally Limited
Data Switch Pin Voltage To Ground (DPOUT, DPIN, DMOUT, DMIN); (VDD powered or unpowered)....... -0.3 to VDD +0.3V
Differential Voltage Across Open Data Switch (DPOUT – DPIN, DMOUT – DMIN, DPIN – DPOUT, DMIN – DMOUT) .........VDD
Voltage on any Other Pin to Ground ................................................................................................... -0.3 to VDD + 0.3V
Current on any Other Pin ......................................................................................................................................±10 mA
Package Power Dissipation ............................................................................................................................... Table 1-1
Operating Ambient Temperature Range .....................................................................................................-40 to +125°C
Storage Temperature Range.......................................................................................................................-55 to +150°C
† Notice:
Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
TABLE 1-1:
POWER DISSIPATION SUMMARY
Board
Package
JC
JA
Derating
Factor Above
+25°C
TA <+25°C
Power
Rating
TA <+70°C
Power
Rating
TA < +85°C
Power
Rating
High K
(see Note 1)
20-pin QFN
4x 4 mm
6°C/W
41°C/W
24.4 mW°/C
2193 mW
1095 mW
729 mW
Low K
(see Note 1)
20-pin QFN
4x 4 mm
6°C/W
60°C/W
16.67 mW°/C
1498 mW
748 mW
498 mW
Note 1:
Junction to ambient (
JA) is dependent on the design of the thermal vias. A High K board uses a thermal
via design with a thermal landing soldered to the PCB ground plane, with 0.3 mm (12 mil) diameter vias in
a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multilayer with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom. A Low K board is a two-layer board without
thermal via design, with 2-ounce copper traces on the top and bottom.


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