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BU4030B датащи(PDF) 8 Page - Rohm

номер детали BU4030B
подробное описание детали  Quad 2-Input Exclusive-OR Gate
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производитель  ROHM [Rohm]
домашняя страница  http://www.rohm.com
Logo ROHM - Rohm

BU4030B датащи(HTML) 8 Page - Rohm

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Datasheet
Datasheet
8/12
BU4030B
BU4030BF
TSZ02201-0RDR1GZ00040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
09.Aug.2013 Rev.001
www.rohm.com
TSZ22111・15・001
I/O Equivalence Circuit
Port
Number
Input Ports
Output Ports
1,2,5,6,8,9,12,13
3,4,10,11
Equivalence
Circuit
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
VDD
GND
VDD
GND
VDD
VDD
GND
GND
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDD


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