поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

BU4030BF-E2 датащи(PDF) 7 Page - Rohm

номер детали BU4030BF-E2
подробное описание детали  Quad 2-Input Exclusive-OR Gate
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  ROHM [Rohm]
домашняя страница  http://www.rohm.com
Logo ROHM - Rohm

BU4030BF-E2 датащи(HTML) 7 Page - Rohm

Back Button BU4030BF-E2 Datasheet HTML 3Page - Rohm BU4030BF-E2 Datasheet HTML 4Page - Rohm BU4030BF-E2 Datasheet HTML 5Page - Rohm BU4030BF-E2 Datasheet HTML 6Page - Rohm BU4030BF-E2 Datasheet HTML 7Page - Rohm BU4030BF-E2 Datasheet HTML 8Page - Rohm BU4030BF-E2 Datasheet HTML 9Page - Rohm BU4030BF-E2 Datasheet HTML 10Page - Rohm BU4030BF-E2 Datasheet HTML 11Page - Rohm Next Button
Zoom Inzoom in Zoom Outzoom out
 7 / 16 page
background image
Datasheet
Datasheet
7/12
BU4030B
BU4030BF
TSZ02201-0RDR1GZ00040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
09.Aug.2013 Rev.001
www.rohm.com
TSZ22111・15・001
Typical Performance Curves - continued
Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame
of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol
θja (°C /W).The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 10 shows the model of thermal resistance of the package. Thermal resistance
θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd
(°C /W)
Derating curve in Figure 11 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance
θja. Thermal resistance θja depends on chip
size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
0
100
200
300
400
500
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
VDD=3V
VDD=5V
VDD=18V
VDD=10V
Operating Temperature Range
Figure 9. “H” to ”L” Propagation Delay Time tPHL
Figure 10. Thermal resistance
周囲温度 Ta [℃]
チップ 表面温度 Tj [℃]
消費電力 P [W]
Ambient temperature Ta (℃)
Chip surface temperature Tj (℃)
Power dissipation Pd (W)
θja=(Tjmax-Ta)/Pd (°C /W)
Figure 11. Derating curve
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
25
50
75
100
125
150
Ambient Temperature [
℃]
BU4030B (DIP14)
BU4030BF (SOP14)
85
1.18
0.56


Аналогичный номер детали - BU4030BF-E2

производительномер деталидатащиподробное описание детали
logo
Rohm
BU4030BF-E2 ROHM-BU4030BF-E2 Datasheet
505Kb / 22P
   High Voltage CMOS Logic ICs
More results

Аналогичное описание - BU4030BF-E2

производительномер деталидатащиподробное описание детали
logo
NXP Semiconductors
74LV86 NXP-74LV86 Datasheet
96Kb / 15P
   Quad 2-input exclusive-OR gate
Rev. 03-27 November 2007
logo
Fairchild Semiconductor
74AC86PC FAIRCHILD-74AC86PC Datasheet
98Kb / 7P
   Quad 2-Input Exclusive-OR Gate
logo
Motorola, Inc
SN54LS386 MOTOROLA-SN54LS386 Datasheet
120Kb / 4P
   QUAD 2-INPUT EXCLUSIVE-OR GATE
logo
NXP Semiconductors
74HC86 PHILIPS-74HC86 Datasheet
34Kb / 6P
   Quad 2-input EXCLUSIVE-OR gate
December 1990
logo
Fairchild Semiconductor
DM74LS86 FAIRCHILD-DM74LS86 Datasheet
61Kb / 5P
   Quad 2-Input Exclusive-OR Gate
logo
Unisonic Technologies
U74LVC86A UTC-U74LVC86A_15 Datasheet
200Kb / 6P
   QUAD 2-INPUT EXCLUSIVE OR GATE
logo
Nexperia B.V. All right...
74HCT86-Q100 NEXPERIA-74HCT86-Q100 Datasheet
226Kb / 12P
   Quad 2-input EXCLUSIVE-OR gate
Rev. 3 - 10 March 2021
logo
NXP Semiconductors
74LV86 PHILIPS-74LV86 Datasheet
103Kb / 10P
   Quad 2-input EXCLUSIVE-OR gate
1998 Apr 20
logo
System Logic Semiconduc...
SL74LS86 SLS-SL74LS86 Datasheet
29Kb / 3P
   Quad 2-Input Exclusive OR Gate
logo
Fairchild Semiconductor
MM74HC86 FAIRCHILD-MM74HC86 Datasheet
81Kb / 7P
   Quad 2-Input Exclusive OR Gate
logo
Hitachi Semiconductor
HD74AC86 HITACHI-HD74AC86 Datasheet
43Kb / 7P
   Quad 2-Input Exclusive-OR-Gate
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


датащи скачать

Go To PDF Page


ссылки URL




Конфиденциальность
ALLDATASHEETRU.COM
Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com