0.20mm [0.008"]

2.96mm [0.116"]

4.55mm [0.179"]

0.80mm typ.

14.40mm [0.567"]

20.90mm [0.823"]

0.80mm typ.

11.90mm [0.469"]

6.40mm

[0.252"]

Ø 0.42mm (x68)

[Ø 0.017"]

Substrate: 1.59mm ±0.18mm [0.062" ±0.007"]

FR4/G10 or equivalent high temp material.

Non-clad.

Side View

Top View

Description: Land Socket

68 position BGA SMT pads to 68 position pins. Pin connection is 1:1.

Status: Released

Drawing: J. Glab

Scale: 4:1

Rev: D

Date: 10/19/06

Modified: 01/17/13, DH

File: LS-BGA68C-61 Dwg.mcd

LS-BGA68C-61 Drawing

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without

notice.

1

2

1

2

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

© 2006 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

RoHS

RoHS