0.8mm typ.

5.6mm [0.220"]

11.6mm

[0.457"]

8mm [0.315"]

1.2mm [0.047"]

2.2mm

[0.087"]

4.55mm

[0.179"]

7.2mm

[0.283"]

2.96mm

[0.117"]

0.2mm dia.

[0.008"]

Status: Released

Drawing: J. Glab

Scale: 6:1

Rev: C

Date: 7/27/07

Modified: 01/18/13

File: LS-BGA80L-61 Dwg.mcd

LS-BGA80L-61 Drawing

Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Pins: material- Brass Alloy 360 1/2

hard; finish- 0.25µm [10µ"] Au over

1.27µm [50µ"] Ni (min.).

Substrate: 1.59mm ±0.18mm [0.0625"

±0.007"] FR4/G10 or equivalent high

temp material; Non-clad

2

1

1

2

Top View

Side View

© 2007 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

Description: Giga-snaP BGA SMT Land Socket

80 position BGA surface mount land pattern to terminal pins (0.8mm centers, 8x10 array)

RoHS

RoHS