15.225

21.225

1.70 (x4)

1.60

12.725

1.2825

3.8225

0.85 (x2)

9.1500

14.0500

Orientation mark

2.10

1.00

1.60

22.125

16.125

4.00 (x4)

15.5000

8.0000

4.00

3.00

TOP VIEW

SIDE VIEW

IC GUIDE

BACKING PLATE

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Comp Det

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 10/13/2015

Material: N/A

Finish: N/A

Weight: 14.00

SMP-QFN-8013 Drawing

SCALE: 3:1

SHEET: 4 OF 6

ENG: S. Huang

FILE: SMP-QFN-8013 Dwg

DRAWN BY: S. Huang