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Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN

AV02-1558EN - March 30, 2015

Precautions

Lead Forming

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering into PC board.

• Ifleadformingisrequiredbeforesoldering,caremustbe

taken to avoid any excessive mechanical stress induced

toLEDpackage.Otherwise,cuttheleadsofLEDtolength

aftersolderingprocessatroomtemperature.Thesolder

joint formed will absorb the mechanical stress of the

lead cutting from traveling to the LED chip die attach

and wirebond.

• It is recommended that tooling made to precisely form

and cut the leads to length rather than rely upon hand

operation.

Soldering Conditions

• Care must be taken during PCB assembly and soldering

process to prevent damage to LED component.

• The closest LED is allowed to solder on board is 1.59

mmbelowthebody(encapsulantepoxy)forthoseparts

without standoff.

• Recommended soldering conditions:

Wave Soldering

Manual Solder

Dipping

Pre-heat Temperature

105 °C Max.

–

Pre-heat Time

30 sec Max.

–

Peak Temperature

250 °C Max.

260 °C Max.

Dwell Time

3 sec Max.

5 sec Max.

• Wave soldering parameter must be set and maintained

accordingtorecommendedtemperatureanddwelltime

in the solder wave. Customer is advised to periodically

check on the soldering profile to ensure the soldering

profile used is always conforming to recommended

soldering condition.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

soldering process.

• Properhandlingisimperativetoavoidexcessivethermal

stresses to LED components when heated. Therefore,

the soldered PCB must be allowed to cool to room

temperature, 25°C, before handling.

• Special attention must be given to board fabrication,

solder masking, surface plating and lead holes size and

component orientation to assure solderability.

• Recommended PC board plated through hole sizes for

LED component leads:

LED Component

Lead Size

Diagonal

Plated Through-

Hole Diameter

Lead size (typ.) 0.45 × 0.45 mm

(0.018 × 0.018 in.)

0.636 mm

(0.025 in)

0.98 to 1.08 mm

(0.039 to 0.043 in)

Dambar shear-

off area (max.)

0.65 mm

(0.026 in)

0.919 mm

(0.036 in)

Lead size (typ.) 0.50 × 0.50 mm

(0.020 × 0.020 in.)

0.707 mm

(0.028 in)

1.05 to 1.15 mm

(0.041 to 0.045 in)

Dambar shear-

off area (max.)

0.70 mm

(0.028 in)

0.99 mm

(0.039 in)

soldering LED components.

Figure 17. Recommended wave soldering profile

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

0

10

20

30

50

100

150

200

250

30

40

50

TIME – SECONDS

60

70

80

90 100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150C (100C PCB)

SOLDER WAVE TEMPERATURE = 245C

AIR KNIFE AIR TEMPERATURE = 390C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE

SUFFICIENTLY COOLED BEFORE EXERTING

MECHANICAL FORCE.