6

SN74LVC1G3157

SCES424L – JANUARY 2003 – REVISED MAY 2017

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(1)

Implications of Slow or Floating CMOS Inputs (SCBA004).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

1.65

5.5

V

Switch input or output voltage

0

V

Control input voltage

0

5.5

V

High-level input voltage, control input

V

Low-level input voltage, control input

V

Δt/Δv

Input transition rise or fall rate

20

ns/V

20

10

10

Operating free-air temperature

BGA package (YZP)

–40

85

°C

All other packages (DBV, DCK,

DRL, DRY, DSF)

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

SN74LVC1G3157

UNIT

DBV (SOT-23)

DCK (SC70)

DRL (SOT)

DRY (SON)

DTB

(X2SON)

YZP

(DSBGA)

6 PINS

6 PINS

6 PINS

6 PINS

6 PINS

6 PINS

Junction-to-ambient thermal resistance

234.9

269.5

244.1

284.2

324.5

129.4

°C/W

Junction-to-case (top) thermal resistance

150.4

189.5

112.5

138.6

150.5

1.9

°C/W

Junction-to-board thermal resistance

86.4

84.7

109.9

170.9

239.0

40.0

°C/W

Junction-to-top characterization

parameter

60.8

62.7

9.3

13.7

17.2

0.6

°C/W

Junction-to-board characterization

parameter

86.1

84.0

109.3

167.9

238.3

40.2

°C/W

Junction-to-case (bottom) thermal

resistance

n/a

n/a

n/a

n/a

n/a

n/a

°C/W