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TMP116 датащи(PDF) 4 Page - Texas Instruments

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номер детали TMP116
подробное описание детали  High-Accuracy, Low-Power, Digital Temperature Sensor With SMBus- and I2C-Compatible Interface
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TMP116, TMP116N
SBOS740 – MAY 2017
www.ti.com
Product Folder Links: TMP116 TMP116N
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
6 Specifications
6.1 Absolute Maximum Ratings
MIN
MAX
UNIT
Supply voltage, V+
–0.3
6
V
Voltage at SCL, SDA, ALERT, and ADD0
–0.3
6
V
Operating junction temperature, TJ
–55
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
V+
Supply voltage
1.9
3.3
5.5
V
TA
Operating free-air temperature
–55
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TMP116
UNIT
DRV (WSON)
6 PINS
RθJA
Junction-to-ambient thermal resistance
68.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
70.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
9.5
°C/W
RθJB
Junction-to-board thermal resistance
38.3
°C/W
ψJT
Junction-to-top characterization parameter
1.7
°C/W
ψJB
Junction-to-board characterization parameter
38.6
°C/W


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