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RT9116 датащи(PDF) 10 Page - Richtek Technology Corporation

номер детали RT9116
подробное описание детали  10W Stereo Class-D Speaker Driver Amplifier
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производитель  RICHTEK [Richtek Technology Corporation]
домашняя страница  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9116 датащи(HTML) 10 Page - Richtek Technology Corporation

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RT9116
10
DS9116-00
November 2016
www.richtek.com
©
Copyright
2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Figure 4. PCB Layout Guide
Layout Considerations
For the best performance of the RT9116, the below PCB
layout guidelines must be strictly followed.
Place the decoupling capacitors as close as possible to
the AVCC, PVDDL, PVDDR and GND pins. For achieving
a good quality, consider adding a small, good performance
low ESR ceramic capacitor between 220pF and 1000pF
and a larger mid-frequency capacitor between 0.1
μF and
1
μF to the PVDD pins of the chip. The traces of (LINP &
LINN, RINP & RINN) and (OUTPL & OUTNL, OUTPR &
OUTNR) should be kept equal width and length
respectively. The thermal pad must be soldered to the
PCB for proper thermal performance and optimal reliability.
The dimensions of the thermal pad and thermal land should
be larger for application. The vias should connect to a
solid copper plane, either on an internal layer or on the
bottom layer of the PCB.
GND
GND
GND
PVDD
INPL
INNL
INNR
INPR
GVDD
AVSS
NC
NC
VOUTPL
PVDDL
VOUTNL
BSTNL
BSTNR
VOUTNR
PVDDR
VOUTPR
GND
PVDD
GND
PVDD
EN
The decoupling capacitor (Cs)
must be placed as close to the IC
as possible
The decoupling capacitor (Cs)
must be placed as close to the
IC as possible
The decoupling capacitor (Cs)
must be placed as close to the
IC as possible
CB
CB
CIN
CIN
CIN
CIN
The gate driver output decoupling
capacitor (Cg) must be placed as
close to the IC as possible
Audio
Input
FB
FB
FB
FB
CB
CB
Cg
GND
PVSS (Thermal Pad) tied to
GND


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