Data Sheet

AD9236

Rev. C | Page 7 of 36

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

With

Respect to

Min

Max

Unit

ELECTRICAL

AVDD

AGND

–0.3

+3.9

V

DRVDD

DGND

–0.3

+3.9

V

AGND

DGND

–0.3

+0.3

V

AVDD

DRVDD

–3.9

+3.9

V

D0 to D11

DGND

–0.3

DRVDD + 0.3

V

CLK, MODE

AGND

–0.3

AVDD + 0.3

V

VIN+, VIN–

AGND

–0.3

AVDD + 0.3

V

VREF

AGND

–0.3

AVDD + 0.3

V

SENSE

AGND

–0.3

AVDD + 0.3

V

REFT, REFB

AGND

–0.3

AVDD + 0.3

V

PDWN

AGND

–0.3

AVDD + 0.3

V

ENVIRONMENTAL

Storage Temperature

–65

+125

°C

Operating Temperature Range

–40

+85

°C

Lead Temperature

(Soldering 10 sec)

300

°C

Junction Temperature

150

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

in still air, in accordance with EIA/JESD51-1.

Table 7.

Package Type

Unit

RU-28

67.7

°C/W

CP-32-7

32.5

32.71

°C/W

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

soldered to the ground plane for the LFCSP package. There is

an increased reliability of the solder joints, and maximum

thermal capability of the package is achieved with the exposed

paddle soldered to the customer board.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.